? semiconductor components industries, llc, 2010 october, 2010 ? rev. 7 1 publication order number: bcp56t1/d bcp56t1 series npn silicon epitaxial transistor these npn silicon epitaxial transistors are designed for use in audio amplifier applications. the device is housed in the sot ? 223 package, which is designed for medium power surface mount applications. features ? high current: 1.0 a ? the sot ? 223 package can be soldered using wave or reflow. the formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die ? available in 12 mm tape and reel use bcp56t1 to order the 7 inch/1000 unit reel use bcp56t3 to order the 13 inch/4000 unit reel ? pnp complement is bcp53t1 ? these devices are pb ? free, halogen free/bfr free and are rohs compliant maximum ratings (t c = 25 c unless otherwise noted) rating symbol value unit collector ? emitter voltage v ceo 80 vdc collector ? base voltage v cbo 100 vdc emitter ? base voltage v ebo 5 vdc collector current i c 1 adc total power dissipation @ t a = 25 c (note 1) derate above 25 c p d 1.5 12 w mw/ c operating and storage temperature range t j , t stg ? 65 to 150 c thermal characteristics characteristic symbol max unit thermal resistance, junction ? to ? ambient (surface mounted) r ja 83.3 c/w maximum temperature for soldering purposes time in solder bath t l 260 10 c sec stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. device mounted on a fr ? 4 glass epoxy printed circuit board 1.575 in x 1.575 in x 0.0625 in; mounting pad for the collector lead = 0.93 sq in. sot ? 223 case 318e style 1 marking diagram collector 2,4 base 1 emitter 3 medium power npn silicon high current transistor surface mount 1 2 3 4 http://onsemi.com see detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ordering information 1 ayw xxxxx xx = specific device code a = assembly location y = year w = work week = pb ? free package (note: microdot may be in either location)
bcp56t1 series http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristics symbol min typ max unit off characteristics collector ? base breakdown voltage (i c = 100 adc, i e = 0) v (br)cbo 100 ? ? vdc collector ? emitter breakdown voltage (i c = 1.0 madc, i b = 0) v (br)ceo 80 ? ? vdc emitter ? base breakdown voltage (i e = 10 adc, i c = 0) v (br)ebo 5.0 ? ? vdc collector ? base cutoff current (v cb = 30 vdc, i e = 0) i cbo ? ? 100 nadc emitter ? base cutoff current (v eb = 5.0 vdc, i c = 0) i ebo ? ? 10 adc on characteristics (note 2) dc current gain (i c = 5.0 ma, v ce = 2.0 v) all part types (i c = 150 ma, v ce = 2.0 v) bcp56t1 bcp56 ? 10t1 bcp56 ? 16t1 (i c = 500 ma, v ce = 2.0 v) all types h fe 25 40 63 100 25 ? ? ? ? ? ? 250 160 250 ? ? collector ? emitter saturation voltage (i c = 500 madc, i b = 50 madc) v ce(sat) ? ? 0.5 vdc base ? emitter on voltage (i c = 500 madc, v ce = 2.0 vdc) v be(on) ? ? 1.0 vdc dynamic characteristics current ? gain ? bandwidth product (i c = 10 madc, v ce = 5.0 vdc, f = 35 mhz) f t ? 130 ? mhz 2. pulse test: pulse width 300 s, duty cycle 2.0% ordering information device marking package shipping ? bcp56t1g bh sot ? 223 (pb ? free) 1000 / tape & reel bcp56t3g bh sot ? 223 (pb ? free) 4000 / tape & reel bcp56 ? 10t1g bh ? 10 sot ? 223 (pb ? free) 1000 / tape & reel bcp56 ? 16t1g bh ? 16 sot ? 223 (pb ? free) 1000 / tape & reel bcp56 ? 16t3g bh ? 16 sot ? 223 (pb ? free) 4000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. typical electrical characteristics
bcp56t1 series http://onsemi.com 3 h fe , dc current gain 100 10 1000 100 10 1 i c , collector current (ma) figure 1. dc current gain i c , collector current (ma) figure 2. current ? gain ? bandwidth product f, current\gain bandwidth product (mhz) t 1000 100 10 100 10 1.0 1000 c, capacitance (pf) 80 60 40 20 10 8.0 6.0 4.0 v r , reverse voltage (volts) figure 3. capacitance 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 figure 4. collector emitter saturation voltage vs. collector current figure 5. base emitter saturation voltage vs. collector current t j = 125 c t j = 25 c t j = - 55 c t j = 25 c c ibo c obo 1000 i c , collector current (a) i c , collector current (a) 1 0.1 0.01 0.001 0.01 0.1 1 1 0.1 0.01 0.001 0.2 0.3 0.4 0.6 0.8 0.9 1.1 1.2 v ce(sat) , collector ? emitter saturation voltage (v) v be(sat) , base ? emitter saturation voltage (v) i c /i b = 10 150 c 25 c ? 55 c 0.5 0.7 1.0 i c /i b = 10 150 c 25 c ? 55 c
bcp56t1 series http://onsemi.com 4 typical electrical characteristics 1.0 0.8 0.6 0.4 0.2 0 i c , collector current (ma) 0.05 0.1 0.2 0.5 2.0 5.0 10 20 50 v ce , collector\emitter voltage (volts) 1.0 50 ma 100ma t j = 25 c 250ma 500ma i c = 10ma figure 6. base emitter voltage vs. collector current i c , collector current (a) 1 0.1 0.01 0.001 0.2 0.3 0.4 0.6 0.8 0.9 1.1 1.2 v be(on) , base ? emitter voltage (v) 0.5 0.7 1.0 v ce = 2 v 150 c 25 c ? 55 c figure 7. collector saturation region t a , ambient temperature ( c) figure 8. safe operating area 1.6 0.8 0.0 100 20 0 160 p d , power dissipation (w) 120 40 140 60 80 1.0 0.2 1.2 0.4 1.4 0.6 figure 9. power derating curve v ce , collector emitter voltage (v) 100 10 1 0.1 0.01 1 i c , collector current (a) 0.1 100 ms 10 ms 1 ms 1 s
bcp56t1 series http://onsemi.com 5 package dimensions sot ? 223 (to ? 261) case 318e ? 04 issue n style 1: pin 1. base 2. collector 3. emitter 4. collector a1 b1 d e b e e1 4 123 0.08 (0003) a l1 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inch. 1.5 0.059 mm inches scale 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 soldering footprint* h e dim a min nom max min millimeters 1.50 1.63 1.75 0.060 inches a1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 d 6.30 6.50 6.70 0.249 e 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 nom max l1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 h e ? ? e1 0 1 0 0 1 0 l l 0.20 ??? ??? 0.008 ??? ??? *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 bcp56t1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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